Title :
Interlayer diffusion and specularity aspects of amorphous CoNbZr-based spin valves
Author :
Ho Gun Cho ; Young Keun Kim ; Seong-Rae Lee
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Univ., Seoul, South Korea
Abstract :
Summary form only given. Among various factors that affect thermal degradation in spin valves (SV), Mn diffusion into pinned and Cu layers appears to be the most harmful to magnetoresistance (MR) and exchange coupling. The effects of CoNbZr (CNZ) film as underlayer and capping layer on thermal stability and Mn diffusion behavior were investigated at elevated temperatures in CNZ 2 nm (or Ta 5 nm)/CoFe/Cu/CoFe/IrMn/CNZ x nm (or Ta 5 nm) stacks. The normalized MR ratio and H/sub ex/ with respect to annealing time were evaluated.
Keywords :
annealing; chemical interdiffusion; cobalt alloys; exchange interactions (electron); magnetoresistance; niobium alloys; spin valves; thermal stability; zirconium alloys; CoNbZr-CoFe-Cu-CoFe-IrMn-CoNbZr; CoNbZr/CoFe/Cu/CoFe/IrMn/CoNbZr; Cu layers; Mn interlayer diffusion; Ta-CoFe-Cu-CoFe-IrMn-Ta; Ta/CoFe/Cu/CoFe/IrMn/Ta; a-CoNbZr-based spin valves; annealing time; capping layer; exchange coupling; magnetoresistance; pinned layers; specularity; thermal degradation; thermal stability; underlayer; Amorphous materials; Annealing; Magnetoresistance; Materials science and technology; Spin valves; Temperature; Thermal degradation; Thermal engineering; Thermal factors; Thermal stability;
Conference_Titel :
Magnetics Conference, 2002. INTERMAG Europe 2002. Digest of Technical Papers. 2002 IEEE International
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
0-7803-7365-0
DOI :
10.1109/INTMAG.2002.1001233
