Title :
Carbon nanotube bundle interconnect: Performance evaluation, optimum repeater size and insertion for global wire
Author :
Patel, Dipen ; Kim, Yong Bin
Author_Institution :
Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
Abstract :
To remove the bottleneck of the interconnect especially at semi-global and global level, performance evaluation of local, semi global, and global interconnect is presented in this paper based on carbon nanotube (CNT) interconnect bundle model. For the greater length of the wire, a methodology is presented to find the optimum insertion and size of buffer for CNT bundle interconnects. The performance analysis for repeater shows that the CNT bundle can run 2.58 times longer without repeater insertion and requires 31% less buffer size than Cu wire.
Keywords :
carbon nanotubes; integrated circuit interconnections; carbon nanotube bundle interconnect; global wire; optimum repeater size; performance analysis; performance evaluation; Carbon nanotubes; Conductivity; Contact resistance; Copper; Electrons; Inductance; Integrated circuit interconnections; Repeaters; Scattering; Wire;
Conference_Titel :
Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4244-7771-5
DOI :
10.1109/MWSCAS.2010.5548711