Title :
Terabus: Chip-to-chip board-level optical data buses
Author :
Kash, J.A. ; Doany, F.E. ; Schow, C.L. ; Budd, R. ; Baks, C. ; Kuchta, D.M. ; Pepeljugoski, P. ; Schares, L. ; Dangel, R. ; Horst, F. ; Offrein, B.J. ; Tsang, C. ; Ruiz, N. ; Patel, C. ; Horton, R. ; Libsch, F. ; Knickerbocker, J.U.
Author_Institution :
IBM Res. Div., T. J. Watson Res. Lab., Yorktown Heights, NY
Abstract :
Optical interconnects using polymer waveguides on circuit boards have been demonstrated. Wirebond-free ultradense transceivers provide 160 Gb/s bidirectional throughput with 16 parallel waveguide-connected transmitters and receivers. Initial designs use 985 nm VCSELs. Migration to the industry-standard 850 nm VCSEL wavelength is underway, also providing lower waveguide loss.
Keywords :
integrated optics; integrated optoelectronics; laser cavity resonators; optical interconnections; optical losses; optical polymers; optical receivers; optical transmitters; optical waveguides; semiconductor lasers; surface emitting lasers; transceivers; Terabus; VCSEL; bit rate 160 Gbit/s; board-level optical data buses; chip-to-chip optical data buses; circuit boards; optical interconnects; parallel waveguide-connected receivers; parallel waveguide-connected transmitters; polymer waveguides; ultradense transceivers; waveguide loss; wavelength 850 nm; wavelength 985 nm; wirebond-free transceivers; Data buses; Optical interconnections; Optical polymers; Optical receivers; Optical transmitters; Optical waveguides; Printed circuits; Throughput; Transceivers; Vertical cavity surface emitting lasers;
Conference_Titel :
IEEE Lasers and Electro-Optics Society, 2008. LEOS 2008. 21st Annual Meeting of the
Conference_Location :
Acapulco
Print_ISBN :
978-1-4244-1931-9
Electronic_ISBN :
978-1-4244-1932-6
DOI :
10.1109/LEOS.2008.4688718
