DocumentCode :
1572124
Title :
Review of optical interconnect(on board or others) development in Japan
Author :
Kurata, Kazuhiko
Author_Institution :
NEC Corp., Kawasaki
fYear :
2008
Firstpage :
517
Lastpage :
518
Abstract :
Activity in development of optical interconnection is growing in Japan. In this review recent Japanese activities are outlined from an opto-electronics package point of view. The most advantage in optical interconnection is in optical wiring such as an optical fiber or optical waveguide. The first motive for optical interconnection is realization of high throughput data transmission beyond speed of electrical transmission. The data throughput of a back plane in routers and servers is well over Tbps. This requires data transmission rates exceeding 10 Gbps . At high bit rates problems in electrical connections begins to appear. The most important problems are in design of input/output (I/O) buffers and in the characteristics of electric parts such as a printed wiring board (PWB) and interposer. To overcome the limitation of electrical connection realization of optical interconnection is expected for high speed transmission. Optical interconnection is considered one of the best solutions to realize low power consumption for high data transmission. On the other hand, additional components like optical transceivers and optical connectors are necessary. These components have to be merged in the circuit board without sacrificing board space or the total manufacturing cost.
Keywords :
data communication; integrated optoelectronics; optical interconnections; optical waveguides; printed circuits; Japan; data transmission; electrical connections; input/output buffers; optical connectors; optical fiber; optical interconnection development; optical transceivers; optical waveguide; optical wiring; opto-electronics package; printed wiring board; Data communication; High speed optical techniques; Integrated circuit interconnections; Optical buffering; Optical devices; Optical interconnections; Optical waveguides; Packaging; Throughput; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEEE Lasers and Electro-Optics Society, 2008. LEOS 2008. 21st Annual Meeting of the
Conference_Location :
Acapulco
Print_ISBN :
978-1-4244-1931-9
Electronic_ISBN :
978-1-4244-1932-6
Type :
conf
DOI :
10.1109/LEOS.2008.4688719
Filename :
4688719
Link To Document :
بازگشت