Title :
Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results
Author :
Riedel, G.J. ; Schmidt, R. ; Liu, C. ; Beyer, H. ; Alaperä, I.
Author_Institution :
Corp. Res., ABB Switzerland Ltd., Baden-Dättwil, Switzerland
Abstract :
Long term reliability is a key requirement for IGBT modules. Besides wire bond degradation solder degradation is a main mechanism leading to IGBT module failures. A numerical model was developed to describe the solder degradation process. The model includes elastic and (time independent) plastic deformation, as well as primary and secondary creep. To verify the model it was successfully applied to different temperature cycle experiments with SnPb solder as well as SnAgCu solder. It was found that primary creep cannot be neglected for SnAgCu solders.
Keywords :
copper alloys; creep; elastic deformation; insulated gate bipolar transistors; lead alloys; lead bonding; plastic deformation; semiconductor device reliability; silver alloys; solders; temperature; tin alloys; IGBT module failure; SnAgCu; SnPb; elastic deformation; large area solder joints; long term reliability; numerical modeling; plastic deformation; primary creep; secondary creep; solder degradation process; temperature cycle; wire bond degradation; Creep; Degradation; Insulated gate bipolar transistors; Numerical models; Strain; Stress; Temperature measurement;
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-3-8007-3414-6
