Title :
Power-oscillator based high efficiency inductive power-link for transcutaneous power transmission
Author :
Ma, Qingyun ; Haider, Mohammad R. ; Yuan, Song ; Islam, Syed K.
Author_Institution :
Dept. of Eng. Sci., Sonoma State Univ., Rohnert Park, CA, USA
Abstract :
Transcutaneous power transmission is a critical issue for long term reliable operation of implantable systems. This paper reports a power-oscillator based inductive power link to power up any implantable unit inside the human body. Instead of using power amplifier which requires high drive requirement, two power-oscillator based inductive powering schemes have been presented to achieve high link efficiency. The first scheme utilizes a class-E power oscillator whereas the second scheme uses a differential cross-coupled power oscillator to drive the inductive link. Resonant inductive link has been used to achieve better link efficiency. Simulation results indicate that for a coupling coefficient of 0.45, the class-E power-oscillator based scheme shows a link efficiency of 66% and the differential cross-coupled power-oscillator based scheme shows more than 90% link efficiency. The system has been designed using 0.5-μm standard CMOS process and both of the systems can handle more than 10 mW of power which is adequate for safe operation of biomedical implants.
Keywords :
CMOS integrated circuits; low-power electronics; oscillators; power amplifiers; prosthetics; CMOS process; biomedical implants; class-E power oscillator; differential cross-coupled power oscillator; efficiency 66 percent; efficiency 90 percent; implantable systems; power amplifier; power-oscillator based high efficiency inductive power-link; power-oscillator based inductive powering schemes; resonant inductive link; size 0.5 mum; transcutaneous power transmission; Batteries; CMOS process; Coils; High power amplifiers; Humans; Implants; Injection-locked oscillators; Power system reliability; Power transmission; Resonance;
Conference_Titel :
Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
Conference_Location :
Seattle, WA
Print_ISBN :
978-1-4244-7771-5
DOI :
10.1109/MWSCAS.2010.5548748