DocumentCode :
1573568
Title :
Gain-enhanced LTCC system-on-package for automotive UMRR applications
Author :
Ghaffar, F.A. ; Khalid, M.U. ; Shamim, A. ; Salama, K.N.
Author_Institution :
Electr. Eng. Program, King Abdullah Univ. of Sci. & Technol. (KAUST), Thuwal, Saudi Arabia
fYear :
2010
Firstpage :
934
Lastpage :
937
Abstract :
A novel Low Temperature Co-fired Ceramic (LTCC) based SoP for automotive radar applications is presented. For the first time a combination of a relatively low dielectric constant LTCC substrate and a high dielectric constant LTCC superstrate has been incorporated to enhance the overall gain of the module. The superstrate can provide additional protection to the integrated circuits (IC) in the harsh automotive environment. A custom cavity in the LTCC substrate can accommodate the IC, which feeds an aperture coupled patch antenna array. The cavity is embedded below the ground plane that acts as a shield for the IC from antenna radiation. It is estimated that with mere 10 dBm of transmitted RF power the miniature SoP module (sized 2.0 cm × 2.0 cm × 0.22 cm) can communicate up to 67 m. The design´s compactness, robustness, transmission power and resultant communication range are highly suitable for Universal Medium Range Radar (UMRR) applications.
Keywords :
antenna radiation patterns; aperture antennas; ceramic packaging; integrated circuits; microstrip antenna arrays; permittivity; road vehicle radar; antenna radiation; aperture coupled patch antenna array; automotive UMRR applications; automotive radar applications; dielectric constant; gain-enhanced LTCC system-on-package; integrated circuits; low temperature co-fired ceramic; universal medium range radar; Apertures; Automotive engineering; Ceramics; Dielectric constant; Dielectric substrates; Feeds; High-K gate dielectrics; Protection; Radar applications; Temperature; Low Temperature Co-fired Ceramic (LTCC); System on Package (SoP); Universal Medium Short Range Radar (UMRR);
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
Conference_Location :
Seattle, WA
ISSN :
1548-3746
Print_ISBN :
978-1-4244-7771-5
Type :
conf
DOI :
10.1109/MWSCAS.2010.5548783
Filename :
5548783
Link To Document :
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