Title :
On structural diagnosis for interconnects
Author :
Sousa, J.T. ; Shen, T. ; Cheung, P.Y.K.
Author_Institution :
Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London, UK
Abstract :
By means of new tools that can extract realistic faults from the PCB layout, generate test vectors and simulate fault diagnosis, we evaluated the applicability of structural diagnosis methods for interconnect faults. The results show that, compared to the traditional behavioural approaches, structural diagnosis can reduce ambiguity in diagnosis and more compact test sets can be employed
Keywords :
fault diagnosis; printed circuit layout; printed circuit testing; production testing; wiring; PCB layout; compact test sets; fault diagnosis; interconnect faults; structural diagnosis; test vectors; wire interconnects; Bonding; Circuit faults; Circuit testing; Costs; Educational institutions; Fault diagnosis; Integrated circuit interconnections; Printed circuits; Surface-mount technology; Wire;
Conference_Titel :
Circuits and Systems, 1996. ISCAS '96., Connecting the World., 1996 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3073-0
DOI :
10.1109/ISCAS.1996.542018
