DocumentCode :
1573802
Title :
Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications
Author :
Rastjagaev, Eugen ; Wilde, Jürgen ; Wielage, Bernhard ; Grund, Thomas ; Kuemmel, S.
fYear :
2012
Firstpage :
1
Lastpage :
6
Abstract :
Within the framework of the presented project, new mounting concepts for power electronics were implemented by applying Al/Cu coat systems to insulators by means of cold gas spraying (CGS). The layers sprayed with cold gas were investigated and good material properties are observed. The applied metallizations show an extremely small porosity, no thermally induced phase conversions or process-related oxides and a high adhesive strength. Also the processing of assemblies with standard processes such as a soldering, adhesive bonding and heavy wire bonding is possible. The temperature shock stability of the new substrates was determined in temperature cycle experiments and it was compared with the temperature shock stability of the DCB substrates. The substrates were tested actively but also passively in bicameral temperature shock chamber and in power cycling experiments at power electronic function samples. The accomplished reliability investigations showed that the characteristic lifetime of the cold gas sprayed substrates is approximately 80% of the characteristic lifetime of the DCB substrates. These demonstrate that the substrates produced in cold-gas technology can be used for power electronic applications.
Keywords :
adhesive bonding; aluminium; assembling; copper; integrated circuit metallisation; integrated circuit reliability; lead bonding; porosity; power electronics; soldering; spray coating techniques; temperature; Al-Cu; CGS; DCB substrate; adhesive bonding; assemblies; bicameral temperature shock chamber; characteristic lifetime; coat system; cold gas sprayed circuit board; cold gas sprayed substrate; cold-gas technology; heavy wire bonding; material properties; metallization; mounting concept; porosity; power cycling; power electronics; reliability; soldering; temperature cycle; temperature shock stability; Aluminum; Ceramics; Conductivity; Copper; Substrates; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-3-8007-3414-6
Type :
conf
Filename :
6170677
Link To Document :
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