DocumentCode :
1573849
Title :
Laser machining of silicon for fabrication of new microstructures
Author :
Alavi, M. ; Buttgenbach, S. ; Schumacher, A. ; Wagner, H.J.
Author_Institution :
Hahn-Schikard-Gesellschaft fur Angewandte Forschung eV., Stuttgart, Germany
fYear :
1991
Firstpage :
512
Lastpage :
515
Abstract :
A method for fabrication of new types of microstructures with high aspect ratio is described. This technique is based on the local destruction of limiting
Keywords :
elemental semiconductors; etching; laser beam applications; laser beam machining; micromechanical devices; semiconductor technology; silicon; Si; Si microstructures; anisotropic etching; disordered zones; elemental semiconductor; feed-throughs; high aspect ratio; hybrid microoptical devices; laser machining; laser melting; limiting; local destruction; micromachining; microslits; partially closed microchannels; precise positioning of fibers; sensor arrays; Anisotropic magnetoresistance; Fiber lasers; Machining; Microstructure; Optical arrays; Optical device fabrication; Optical fiber sensors; Optical sensors; Sensor arrays; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
Type :
conf
DOI :
10.1109/SENSOR.1991.148925
Filename :
148925
Link To Document :
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