DocumentCode
1573849
Title
Laser machining of silicon for fabrication of new microstructures
Author
Alavi, M. ; Buttgenbach, S. ; Schumacher, A. ; Wagner, H.J.
Author_Institution
Hahn-Schikard-Gesellschaft fur Angewandte Forschung eV., Stuttgart, Germany
fYear
1991
Firstpage
512
Lastpage
515
Abstract
A method for fabrication of new types of microstructures with high aspect ratio is described. This technique is based on the local destruction of limiting
Keywords
elemental semiconductors; etching; laser beam applications; laser beam machining; micromechanical devices; semiconductor technology; silicon; Si; Si microstructures; anisotropic etching; disordered zones; elemental semiconductor; feed-throughs; high aspect ratio; hybrid microoptical devices; laser machining; laser melting; limiting; local destruction; micromachining; microslits; partially closed microchannels; precise positioning of fibers; sensor arrays; Anisotropic magnetoresistance; Fiber lasers; Machining; Microstructure; Optical arrays; Optical device fabrication; Optical fiber sensors; Optical sensors; Sensor arrays; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-87942-585-7
Type
conf
DOI
10.1109/SENSOR.1991.148925
Filename
148925
Link To Document