Mixed-Signal and Smart-Power Capable Hybrid Structured ASIC for Cost-Aware Single-Chip Integration of Industrial Applications

Author

Zhang, Yipin ; Scherjon, Cor ; Burghartz, Joachim N.

Author_Institution

CHIPS, Inst. for Microelectron. Stuttgart, Stuttgart, Germany

fYear

2012

Firstpage

1

Lastpage

4

Abstract

A new single-chip integration approach for industrial applications based on novel mixed-signal and smart-power capable hybrid structured ASIC is presented. The hybrid structured ASIC, offering low non-recurring engineering (NRE) costs of low-voltage (LV) structured ASICs as well as power electronic functionalities of cell based smart-power ICs, provides a cost-efficient integration platform for industrial applications. Based on the demonstrator chip fabricated in a 0.8micrometer high-voltage (HV) bipolar, CMOS, DMOS (BCD) silicon on insulator (SOI) process, construction of the hybrid structured ASIC is illustrated in detail and the applicability of the platform is successfully demonstrated.

Keywords

CMOS integrated circuits; application specific integrated circuits; power integrated circuits; silicon-on-insulator; CMOS; DMOS; NRE; SOI process; cost-aware single-chip integration; high-voltage bipolar; industrial applications; mixed-signal hybrid structured ASIC; nonrecurring engineering; power electronic functionalities; silicon on insulator; smart-power IC; smart-power capable hybrid structured ASIC; Application specific integrated circuits; Field programmable gate arrays; Metallization; Periodic structures; Regulators; Resistors; Voltage control;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on

Conference_Location

Nuremberg

Print_ISBN

978-3-8007-3414-6

Type

conf

Filename

6170679