Title : 
High fMAX/fT ratio in multi-finger embedded T-shaped gate graphene transistors
         
        
            Author : 
Shu-Jen Han ; Oida, Soushi ; Jenkins, Keith A. ; Lu, Dylan Dah-Chuan
         
        
            Author_Institution : 
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
         
        
        
        
        
            Abstract : 
Remarkable progress has been made in both graphene RF transistor level [1] and the circuit level [2]. Despite the demonstrated high current gain cutoff frequency (fT), most devices also show significantly lower maximum oscillation frequency (fMAX), which is a crucial figure of merit that really determines the device performance in most RF circuits. It is well known that gate resistance (Rg) plays a key role in deciding fMAX, and T-shaped gate structures have been adopted in semiconductor industries for very high-speed RF transistor designs by maximizing the cross-sectional area of the gate. This paper presents an embedded T-gate graphene FET structure. With merely 1 V drain bias, extrinsic fMAX up to 20 GHz, and about 25% to 55% higher than fT, is achieved from devices with a channel length down to 250 nm. Besides the same key advantage of the embedded gate - bypassing the use of seed layers for obtaining ultra-high quality gate dielectrics [3], this new structure also provides uncomplicated process flow, low parasitic capacitance, and simple circuit wiring.
         
        
            Keywords : 
graphene; microwave field effect transistors; C; T-gate graphene FET structure; circuit wiring; cross sectional area; drain bias; frequency 20 GHz; gate resistance; graphene RF transistor level; low parasitic capacitance; lower maximum oscillation frequency; multifinger embedded T-shaped gate graphene transistors; voltage 1 V; Capacitance; Dielectrics; Graphene; Logic gates; Performance evaluation; Radio frequency; Transistors;
         
        
        
        
            Conference_Titel : 
Device Research Conference (DRC), 2013 71st Annual
         
        
            Conference_Location : 
Notre Dame, IN
         
        
        
            Print_ISBN : 
978-1-4799-0811-0
         
        
        
            DOI : 
10.1109/DRC.2013.6633781