DocumentCode :
1573996
Title :
Highly linear very compact untrimmed on-chip temperature sensor with second and third order temperature compensation
Author :
He, Jun ; Zhao, Chen ; Lee, Sheng-Huang ; Peterson, Karl ; Geiger, Randall ; Chen, Degang
Author_Institution :
Dept. of Electr. & Comput. Eng., Iowa State Univ., Ames, IA, USA
fYear :
2010
Firstpage :
288
Lastpage :
291
Abstract :
This paper proposes a CMOS structure as a highly linear on-chip temperature sensor. As long as all transistors are in saturation, the output of the structure is a VDD independent voltage source that linearly expresses CMOS threshold voltage, and hence is approximately linear in temperature. A new sizing strategy is introduced following a combined analytical and numerical optimization approach, which effectively removes both second and third order nonlinearities. Following this sizing approach, the sensor output voltage can be made very linear in temperature, with temperature INL (maximum temperature errors due to Vout temperature nonlinearity) within 0.05°C over the temperature range of -20~100°C. Results from corner simulations and Monte Carlo simulations demonstrate that the sensor linearity has excellent robustness over process variation and local device mismatches. With a standard two point calibration, the sensor´s maximum output error can be confined within 0.15°C without any trimming. The sensor is very compact with a total active area around 200 μm2 when implemented in 0.18μm process.
Keywords :
CMOS integrated circuits; Monte Carlo methods; temperature sensors; CMOS; Monte Carlo simulations; Vout temperature nonlinearity; on-chip temperature sensor; second order nonlinearities; second order temperature compensation; sensor linearity; size 0.18 mum; temperature -20 C to 100 C; third order nonlinearities; third order temperature compensation; CMOS technology; Circuit synthesis; Energy consumption; Equations; Linearity; Pulse amplifiers; Temperature dependence; Temperature distribution; Temperature sensors; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
Conference_Location :
Seattle, WA
ISSN :
1548-3746
Print_ISBN :
978-1-4244-7771-5
Type :
conf
DOI :
10.1109/MWSCAS.2010.5548802
Filename :
5548802
Link To Document :
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