DocumentCode
1574953
Title
Controlling electronic properties of wafer-bonded interfaces among dissimilar materials: A path to developing novel wafer-bonded devices
Author
Lal, Shalini ; Lu, Jing ; Guidry, Matthew ; Thibeault, Brian ; DenBaars, Steven P. ; Mishra, Umesh K.
Author_Institution
Department of Electrical and Computer Engineering, Materials Department, University of California, Santa Barbara, CA 93106
fYear
2013
Firstpage
121
Lastpage
122
Abstract
A breakthrough in understanding the nature of wafer-bonded interfaces is reported. The DC-behavior of a wafer-bonded heterojunction between In0.53 Ga0.47 As (InGaAs) and In0.1 Ga0.9 N (InGaN) is investigated by using a wafer-bonded vertical electron transistor (BAVET) structure with an In0.52 Al0.48 As (InAlAs) gate-barrier-layer. It is demonstrated that the Fermi-level of the InAlAs layer influences the wafer-bonded-interface properties (WBIP) during the wafer-bonding of InGaAs to InGaN. Specifically, by using a high p-doping in the InAlAs layer, a dramatic improvement in the WBIP and consequently, a high-breakdown for a BAVET is demonstrated.
Keywords
Apertures; Capacitance-voltage characteristics; Gallium nitride; Indium gallium arsenide; Logic gates; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2013 71st Annual
Conference_Location
Notre Dame, IN
ISSN
1548-3770
Print_ISBN
978-1-4799-0811-0
Type
conf
DOI
10.1109/DRC.2013.6633823
Filename
6633823
Link To Document