Title :
Electrocontact microdisplacement testing subsystem
Author :
Zagursky, V. ; Zibinch, Dz
Author_Institution :
Inst. of Electron. & Comput. Sci., Latvian Univ., Riga, Latvia
fDate :
6/21/1905 12:00:00 AM
Abstract :
The subsystem relates to control, testing and measurement instrumentation with closed digital control loop structure and may be used, in particular, for testing and measurement of smooth displacements resulting from, for example, force or temperature deformation of an object, or for detection of changes in geometric dimensions of an object while monitoring its airtightness, e.g. monitoring the airtightness of integrated circuit packages. Also, it may be used with some additions for tactile sensing in robotic systems
Keywords :
closed loop systems; digital control; displacement measurement; integrated circuit packaging; integrated circuit testing; microsensors; monitoring; airtightness; circuit packages; closed digital control loop structure; control instrumentation; electrocontact microdisplacement testing subsystem; force deformation; geometric dimensions; integral circuits; integral microcircuits; measurement instrumentation; robotic systems; smooth displacements; tactile sensing; temperature deformation; testing instrumentation; watertightness; Circuit testing; Displacement control; Displacement measurement; Force control; Force measurement; Instruments; Integrated circuit testing; Monitoring; Particle measurements; Temperature control;
Conference_Titel :
Africon, 1999 IEEE
Conference_Location :
Cape Town
Print_ISBN :
0-7803-5546-6
DOI :
10.1109/AFRCON.1999.820943
