Characteristics of interconnect lines with patterned ground shields and its implication for microwave ICs

Author

Lee, Sang-Gug ; Gwak, Hyuk-Yong ; Lowther, Rex

Author_Institution

Sch. of Eng., Inf. & Commun., Taejon Univ., South Korea

fYear

1999

fDate

6/21/1905 12:00:00 AM

Firstpage

444

Lastpage

447

Abstract

The integrated circuit interconnects are experimented with patterned ground shields (PGS) at microwave frequencies. Measurement results demonstrate that the PGS can considerably reduce the power loss at high frequencies as the PGS shields the lossy silicon substrate. Furthermore. The PGS reduces the wave length of the interconnect line as a transmission line. The reduction of the wave length has significant implications in microwave IC design as the technique can be used to shorten the transmission line length for a given electrical length

Keywords

electromagnetic shielding; integrated circuit interconnections; microwave integrated circuits; Si; interconnect line; microwave integrated circuit; patterned ground shield; power loss; silicon substrate; transmission line; Frequency measurement; Integrated circuit interconnections; Integrated circuit measurements; Loss measurement; Microwave frequencies; Microwave integrated circuits; Power measurement; Power transmission lines; Silicon; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI and CAD, 1999. ICVC '99. 6th International Conference on

Conference_Location

Seoul

Print_ISBN

0-7803-5727-2

Type

conf

DOI

10.1109/ICVC.1999.820959

Filename

820959