• DocumentCode
    157845
  • Title

    Study on standardized testing methodologies for embedded pavement status sensors

  • Author

    Lei Cai ; Bin Li ; Chunlei Meng

  • Author_Institution
    Nat. Center of ITS Eng. & Technol., M.O.T., Beijing, China
  • fYear
    2014
  • fDate
    8-10 Oct. 2014
  • Firstpage
    372
  • Lastpage
    377
  • Abstract
    This paper proposes the standardized testing methodologies for embedded pavement status sensors based on the road weather meteorological environment monitoring and service requirements. A large number of possible testing procedures were developed for measuring pavement surface temperature, sensor moisture state and the water film thickness. In a year and a half of the time, three factory embedded pavement status Sensors are tested, the outdoor data in different environment including rainy, snowy, sunny and freeze days is analyzed. The test results verify the accuracy, maneuverability and repeatability of the testing technology, and the standardized testing methodologies will fill the blank of domestic pavement status sensors testing methodologies, improve the efficiency of the highway maintenance and highway management, avoid highway traffic delay, reduce the traffic accident due to bad weather.
  • Keywords
    maintenance engineering; moisture measurement; road accidents; road traffic; roads; sensors; thickness measurement; domestic pavement status sensors testing methodologies; embedded pavement status sensors; highway maintenance; highway management; pavement surface temperature measurement; road weather meteorological environment monitoring; sensor moisture state measurement; service requirements; standardized testing methodologies; traffic accident reduction; water film thickness measurement; Agriculture; Forestry; Laboratories; Meteorology; Roads; Temperature measurement; Embedded pavement Sensors; surface condition; test environment; testing methodologies;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Service Operations and Logistics, and Informatics (SOLI), 2014 IEEE International Conference on
  • Conference_Location
    Qingdao
  • Type

    conf

  • DOI
    10.1109/SOLI.2014.6960753
  • Filename
    6960753