DocumentCode :
1579083
Title :
Methodology for targeted defect reduction and inspection optimization
Author :
Skumanich, Andy ; Ryabova, Elmira
Author_Institution :
Appl. Mater. Inc., Santa Clara, CA, USA
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
72
Lastpage :
76
Abstract :
A methodology is outlined to establish the prioritization of defects under conditions of low sampling statistics based on the deliberate introduction of defects at specific process points. Probe results from electrical test structures are correlated with optical defect inspection data to determine the kill rates of various defects. The methodology generalizes from a standard approach that typically relies on a high statistical sampling plan with significant wafer area coverage. In this case, the probed area coverage is reduced to 1-3% of the wafer surface but still provides defect impact prioritization for targeted defect reduction and optimized inspection strategies for optical capture and SEM review.
Keywords :
inspection; scanning electron microscopy; SEM review; area coverage; defect impact prioritization; defect kill rate; defect reduction; electrical test structure; inspection optimization; optical capture; sampling statistics; semiconductor wafer; yield; Feedback loop; Inspection; Optical feedback; Optical materials; Optimization methods; Probes; Sampling methods; Statistical analysis; Statistics; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop
Print_ISBN :
0-7803-7158-5
Type :
conf
DOI :
10.1109/ASMC.2002.1001577
Filename :
1001577
Link To Document :
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