• DocumentCode
    1579992
  • Title

    Yield/reliability enhancement using automated minor layout modifications

  • Author

    Allan, Gerard A.

  • Author_Institution
    Dept. Electron. & Electr. Eng., Edinburgh Univ., UK
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    252
  • Lastpage
    261
  • Abstract
    This paper reports a new layout modification tool for the automation of yield and reliability enhancement of IC layout. The peye tool combines the eye (Edinburgh Yield Estimator) with Perl (Practical Extraction and Reporting Language). This new tool permits complex layout modification operations to be defined using the powerful language features of Perl. The new peye tool has been interfaced with a sampling based yield prediction system to enable the measurement of the layout modifications and yield predictions based on these modifications. This enables the usefulness of a modification to a particular design to be assessed before use. Both the sampled measurement and the final modifications to the whole chip database can be farmed out to a number of networked computers, enabling the system to assess and apply layout modifications to large industrial ICs in a reasonable time. Results of layout modifications are presented.
  • Keywords
    CMOS integrated circuits; Perl; circuit layout CAD; integrated circuit layout; integrated circuit reliability; integrated circuit yield; sampling methods; CMOS technology; Edinburgh yield estimator; IC layout; Perl; automated minor layout modifications; chip database; large industrial ICs; networked computers; peye tool; practical extraction reporting language; reliability enhancement; sampled measurement; sampling based yield prediction system; yield enhancement; Algorithms; Automation; Data mining; Data structures; Geometry; Integrated circuit layout; Sampling methods; Semiconductor device measurement; Wires; Yield estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop
  • Print_ISBN
    0-7803-7158-5
  • Type

    conf

  • DOI
    10.1109/ASMC.2002.1001614
  • Filename
    1001614