DocumentCode :
1580133
Title :
Transporting FOUPs as a driver for ESD-induced EMI
Author :
Levit, Larry B. ; Montoya, Julian A.
Author_Institution :
Ion Syst. Inc, Berkeley, CA, USA
fYear :
2002
fDate :
6/24/1905 12:00:00 AM
Firstpage :
289
Lastpage :
294
Abstract :
FOUPs are constructed from insulative plastics. As such, they take on charges of multiple kilovolts and carry large electric fields with them. Because of the large size of the FOUP, appreciable fields extend for a distance of >30 cm from the FOUP and can reach many objects withing the cleanroom. When the fields intersect an ungrounded or poorly grounded conductor, metal-to-metal discharges can occur. These discharges, in turn radiate nanosecond pulses (transient EMI) which can disrupt robotics. This paper details the measurement of such transients in an operating 300 mm fab. The results show that EMI is created by manual handling of FOUPs but that charged FOUPs moving in an overhead track are a much greater cause of EMI with the potential for robotic difficulties.
Keywords :
electromagnetic interference; electrostatic discharge; industrial robots; integrated circuit manufacture; materials handling; transients; 300 mm; 300 mm fab; ESD-induced EMI; FOUP transport; cleanroom; insulative plastics; manual handling; metal-to-metal discharges; multiple kilovolts; nanosecond pulses; overhead track; poorly grounded conductor; robotics disruption; semiconductor manufacturing; transient EMI; transients measurement; ungrounded conductor; Conductors; Electromagnetic interference; Electrostatic discharge; Insulation; Microprocessors; Printed circuits; Robots; Semiconductor device manufacture; Surface charging; Surface contamination;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop
Print_ISBN :
0-7803-7158-5
Type :
conf
DOI :
10.1109/ASMC.2002.1001620
Filename :
1001620
Link To Document :
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