DocumentCode
1580509
Title
Supercritical fluid processes for semiconductor device fabrication
Author
Rothman, Laura B. ; Robey, Raymond J. ; Ali, Mir K. ; Mount, David J.
Author_Institution
SC Fluids Inc., Nashua, NH, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
372
Lastpage
375
Abstract
As semiconductor device dimensions approach the nanoscale, it will become increasing difficult to use aqueous-based cleaning processes due to high surface tension and capillary forces. Supercritical fluids provide the enabling capabilities for overcoming these process barriers. This paper will discuss the use of supercritical carbon dioxide and co-solvents for photoresist stripping and wafer cleaning.
Keywords
semiconductor technology; surface cleaning; CO2; co-solvent; photoresist stripping; semiconductor device fabrication; supercritical carbon dioxide; supercritical fluid processing; wafer cleaning; Carbon dioxide; Cleaning; Fabrication; Gases; Nanoscale devices; Resists; Semiconductor devices; Solvents; Surface tension; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing 2002 IEEE/SEMI Conference and Workshop
Print_ISBN
0-7803-7158-5
Type
conf
DOI
10.1109/ASMC.2002.1001636
Filename
1001636
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