DocumentCode :
1581155
Title :
Parameters optimization of Lateral Impact Ionization MOS (LIMOS)
Author :
Dixit, Abhishek ; Singh, Sushil ; Kondekar, P.N. ; Kumar, Pranaw ; Modi, Bharti
Author_Institution :
Dept. of Electron. & Commun. Eng., PDPM-IIITDM, Jabalpur, India
fYear :
2013
Firstpage :
56
Lastpage :
60
Abstract :
Impact Ionization MOSFET (IMOS), has emerged to combat one of the most critical and fundamental problem of sub-threshold slope (SS) which cannot be lower than 60mV/decade at room temperature for conventional MOSFET, as conventional MOSFET works on the principle of diffusion of charge carrier for the current flow in the device. Whereas, the IMOS devices work on the principle of avalanche breakdown to switch from the `OFF´ state to `ON´ state. In this paper, we have optimized the device performance of the Lateral impact ionization MOSFET (LIMOS) by varying the device dimensional parameters, such as gate length Lg, intrinsic length Lin, gate dielectric thickness tox and biasing voltages Vg and Vs. Simulation results claims that the ratio of Lg/Lin has to be properly tuned for the optimum device performance. If this ratio approaches to one LIMOS performance are optimized, whereas if it is very higher than one it behaves as Tunnel Field Effect Transistor (TFET) and if it is very less than one it effectively behaves as gated PIN diode. Simulation results show the sub-threshold slope SS to be 1.373mV/dec for our optimized LIMOS. Considerable improvement in other device performance parameters namely Ion, Ioff, Ion/Ioff ratio, threshold voltage Vth, breakdown voltage Vbr, drain induced current enhancement DICE, and gate induced barrier lowering GIBL has been reported.
Keywords :
MOSFET; avalanche breakdown; field effect transistors; p-i-n diodes; semiconductor device breakdown; LIMOS; PIN diode; TFET; avalanche breakdown; biasing voltages; breakdown voltage; drain induced current enhancement; gate dielectric thickness; gate induced barrier lowering; gate length; impact ionization MOSFET; intrinsic length; lateral impact ionization MOS; parameters optimization; temperature 293 K to 298 K; threshold voltage; tunnel field effect transistor; Impact ionization; Logic gates; MOSFET; Optimization; Performance evaluation; Semiconductor process modeling; Simulation; Impact Ionization MOSFET (IMOS); drain induced current enhancement (DICE); gate induced barrier lowering (GIBL); gated PIN diode;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Global High Tech Congress on Electronics (GHTCE), 2013 IEEE
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/GHTCE.2013.6767240
Filename :
6767240
Link To Document :
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