Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales

Microsystem technology is a key driver in the rapid migration of thermal science and technology towards the micro and nano scales. The deleterious effects of heat generation and thermally-induced failures of micro/nano electronic and photonic components have necessitated the development of thermal packaging solutions at progressively smaller scales. This lecture will define the emerging micro/nano thermal packaging challenges and explore solid state refrigeration and dielectric liquid cooling techniques for addressing on-chip hot spots in high heat flux chips, as well as the use of high conductivity polymer composites for cooling of notebook and portable computers. Thermo-optic issues in the use of polymer waveguides and gratings will also be considered