• DocumentCode
    1583302
  • Title

    Analysis of structural mechanics of solid microneedle using COMSOL software

  • Author

    Kanakaraj, Urvi ; Lhaden, Tshewang ; Karthik Raj, V.

  • Author_Institution
    Dept. of Biomed. Eng., SRM Univ., Chennai, India
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Microneedles are currently being extensively researched for therapeutic and diagnostic applications, as they are painless, cheaper than conventional needles, and reduce risk of infection. In this paper, we have selected 10 materials for solid microneedle and have performed the structural analysis of each material using COMSOL Multiphysics 4.3. The study was based on the factors affecting microneedle strength such as buckling and bending forces. The result indicated that the microneedle made of Silicon carbide was superior to the other selected materials and while considering the property of biodegradability for the same study, Silk was preferred. PLA and Polycarbonate experienced buckling and thus were not preferred from the selected materials.
  • Keywords
    bending; bioMEMS; biodegradable materials; buckling; materials science computing; needles; silicon compounds; COMSOL Multiphysics 4.3 software; PLA; SiC; bending forces; biodegradability; buckling; diagnostic applications; microneedle strength; polycarbonate; silicon carbide; silk; solid microneedle; structural analysis; therapeutic applications; Drugs; Force; Needles; Programmable logic arrays; Silicon carbide; Skin; Stress; COMSOL Multiphysics 4.3; Silicon Carbide; Solid Microneedle; bending; buckling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Innovations in Information, Embedded and Communication Systems (ICIIECS), 2015 International Conference on
  • Conference_Location
    Coimbatore
  • Print_ISBN
    978-1-4799-6817-6
  • Type

    conf

  • DOI
    10.1109/ICIIECS.2015.7193243
  • Filename
    7193243