Title :
Thermal Evaluations of FCBGA With Embedded Hot Spot Designs
Author :
Chen, Eason ; Lai, Jeng Yuan ; Wang, Yu-Po ; Hsiao, C.S.
Author_Institution :
Siliconware Precision Ind. Co. Ltd., Taichung
Abstract :
With the evolving function integration and power consumption of high-end IC applications, thermal management has become one of the most important concerns of semiconductor designers. In particular, hot spot problem, in recent years, has turned into a popular topic in IC chip thermal management that it comes from the uneven power consumptions in various logical blocks and results in local high temperature that would increase IC chip failure risks. In this paper, thermal evaluations for hot spot impacts on flip-chip ball grid array (FC-BGA) packages were presented using CFD modeling technique. The evaluation topics covered hot spot power density effects on substrate designs and heat sink module characterizations including passive heat sink, fan heat sink, and water-cooling heat sink performance under various hot spot conditions
Keywords :
ball grid arrays; flip-chip devices; heat sinks; thermal management (packaging); FCBGA; IC chip thermal management; fan heat sink; flip-chip ball grid array packages; heat sink module; high-end IC applications; passive heat sink; thermal evaluations; water-cooling heat sink; Application specific integrated circuits; Computational fluid dynamics; Electronics packaging; Energy consumption; Energy management; Heat sinks; Risk management; Temperature; Thermal management; Water heating; CFD; FC-BGA; hot spot; simulation;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
DOI :
10.1109/IMPACT.2006.312185
