DocumentCode :
1583593
Title :
Embedded Wide-Band Filter on Rigid / Flex. Multilayer PCB for SiP
Author :
Yu, Syun ; Chen, Chang-Sheng ; Wei, Chang-Lin ; Tsia, Cheng-Hua ; Jow, Uei-Ming ; Shyu, Chin-Sun ; Lay, Sinn-Juh ; Lee, Min-Lin
Author_Institution :
Lab. of Electron. & Opto-electron. Res., Ind. Technol. Res. Inst., Hsinchu
fYear :
2006
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, a novel method to realize wide-band band-pass filter is presented. The filter is constructed by serial and shunt transmission-line sections and fabricated on multilayer PCB substrates. The frequency response is specified with a pass band of 1.8-5.8 GHz, and with less than 3 dB insertion losses and more than 10 dB return losses in the pass band. Good agreement between the measured and simulated results has been observed. In addition, the transformation models of flexible substrates are also studied by using the 3D electromagnetic simulator. It is shown that the deviations of frequency responses are less than 10% of the unfolded case. Thus, the filter´s structure is suitable for both rigid and flexible substrates
Keywords :
UHF filters; band-pass filters; microwave filters; printed circuits; system-in-package; 1.8 to 5.8 GHz; 3D electromagnetic simulator; SiP; embedded wide-band filter; flexible substrates; frequency responses; multilayer PCB; rigid substrates; shunt transmission-line sections; system-in-package; wide-band band-pass filter; Band pass filters; Bandwidth; Dielectric materials; Dielectric substrates; Multimedia communication; Nonhomogeneous media; Radio frequency; Transmission lines; Wideband; Wireless communication; RF; SiP; System-in-Package; Wide-band; band-pass filter; flexible substrates; multilayer PCB substrates; printed circuit board (PCB); transformation model; transmission-line; wireless communication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
Type :
conf
DOI :
10.1109/IMPACT.2006.312187
Filename :
4107444
Link To Document :
بازگشت