• DocumentCode
    1583593
  • Title

    Embedded Wide-Band Filter on Rigid / Flex. Multilayer PCB for SiP

  • Author

    Yu, Syun ; Chen, Chang-Sheng ; Wei, Chang-Lin ; Tsia, Cheng-Hua ; Jow, Uei-Ming ; Shyu, Chin-Sun ; Lay, Sinn-Juh ; Lee, Min-Lin

  • Author_Institution
    Lab. of Electron. & Opto-electron. Res., Ind. Technol. Res. Inst., Hsinchu
  • fYear
    2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a novel method to realize wide-band band-pass filter is presented. The filter is constructed by serial and shunt transmission-line sections and fabricated on multilayer PCB substrates. The frequency response is specified with a pass band of 1.8-5.8 GHz, and with less than 3 dB insertion losses and more than 10 dB return losses in the pass band. Good agreement between the measured and simulated results has been observed. In addition, the transformation models of flexible substrates are also studied by using the 3D electromagnetic simulator. It is shown that the deviations of frequency responses are less than 10% of the unfolded case. Thus, the filter´s structure is suitable for both rigid and flexible substrates
  • Keywords
    UHF filters; band-pass filters; microwave filters; printed circuits; system-in-package; 1.8 to 5.8 GHz; 3D electromagnetic simulator; SiP; embedded wide-band filter; flexible substrates; frequency responses; multilayer PCB; rigid substrates; shunt transmission-line sections; system-in-package; wide-band band-pass filter; Band pass filters; Bandwidth; Dielectric materials; Dielectric substrates; Multimedia communication; Nonhomogeneous media; Radio frequency; Transmission lines; Wideband; Wireless communication; RF; SiP; System-in-Package; Wide-band; band-pass filter; flexible substrates; multilayer PCB substrates; printed circuit board (PCB); transformation model; transmission-line; wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
  • Conference_Location
    Taipei
  • Print_ISBN
    1-4244-0735-4
  • Electronic_ISBN
    1-4244-0735-4
  • Type

    conf

  • DOI
    10.1109/IMPACT.2006.312187
  • Filename
    4107444