Title :
The development of a high performance, low cost package for MEMS Microphone package by using Lead-frame Land Grid Array (LLGA)
Author :
Tien, Jiung-Yue ; Yung, His-Chen ; Tu, Min-Te ; Huang, Chin-Ching
Author_Institution :
TEPZ, Taichung
Abstract :
A new MEMS microphone package have been developed. A new technical process of LGA is utilized to meet the light, thin, short, small and high performance package. The developed leadframe based MEMS microphone can adopt SMD process, which can be applied to automatic cell phone microphone assembly process, and reduce 20% of the production cost
Keywords :
electronics packaging; microassembling; micromechanical devices; microphones; mobile handsets; LLGA; MEMS microphone package; SMD process; automatic cell phone microphone assembly process; lead-frame land grid array; low cost package; Assembly; Cellular phones; Conducting materials; Costs; Electromagnetic fields; Micromechanical devices; Microphone arrays; Packaging; Sheet materials; Transfer functions; Lead-frame; MEMS Microphone; SMD; low cost;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
DOI :
10.1109/IMPACT.2006.312197
