Green Certification for IC BGA Package

EU ROHS has been starting since 1 July 2006, the global environmental pressure to phase out Pb/Cd/Hg/Cr⁺⁶ and PBBs/PBDEs usage in electronics application has been unavoidable to comply, especially in Asian electronic manufacturer. In fact, besides the 6 substances regulated by RoHS, more environmentally conscious substances is being considered to be incorporated together to identify green compliance for IC package. Therefore, how to identify the IC package developed will be compliance with RoHS or different green regulation, has been getting into more and more argument in the supply chain. Various type and PPM threshold (TLV) recognition for concerned conscious substances such as more halogen substances and Sb₂O ₃ even more from JIG, is making manufacturers confused to follow now. In this report, the PBGA package was taken as test vehicle. The MSL performance and lead free reflow profile resistance were brought up for discussion, as well as RoHS and green material testing. Furthermore, the major material to compose of IC package like molding compound, die attach, substrate, solder ball, were subject to destructive wet digestion then was followed by certain analysis to identify the existing of Pb/Cd/Hg/Cr⁺⁶, PBBs/PBDEs, other halogen substances and Sb₂O₃. One green certification methodology for IC package is recommended from environment compliance and technical performance perspective