Title :
Solder joints reliability of leaded surface mounted components-a requirement for new quality insurance procedures
Author :
Saint-Martin, X. ; Joly, J.
Author_Institution :
BULL SA, Les Clayes-Sous-Bois, France
Abstract :
The objective of this work is to analyze stresses induced in the solder joint and to minimize the risk of crack initiation at the solder-joint level. Thermomechanical analysis of solder joints and thermomechanical simulation have helped the authors to optimize the process, to give recommendations for solder-joint inspection, and to put in place new quality insurance procedures that take into account the thermomechanical parameters of components and mounting processes. Experimental results support these first simulation results. Recommendations and proposals for new quality insurance procedures are presented.<>
Keywords :
circuit reliability; quality control; soldering; surface mount technology; crack initiation; leaded surface mounted components; mounting processes; quality insurance procedures; solder joint; thermomechanical parameters; thermomechanical simulation; Analytical models; Inspection; Insurance; Lead; Proposals; Risk analysis; Soldering; Surface cracks; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16158
