Title :
Impact of IMC Thickness on Lead-free Solder Joint Reliability under Thermal Aging: Ball Shear Tests vs. Cold Bump Pull Tests
Author :
Lee, S. W Ricky ; Song, Fubin
Author_Institution :
Lab. of Electron. Packaging, Hong Kong Univ. of Sci. & Technol., Kowloon
Abstract :
Ball pull test has emerged to be an attractive alternative to the traditional ball shear method for characterizing the attachment strength of solder interconnection. Since it is a relatively new development, so far there is not industrial standard to regulate this testing method. This paper describes firstly the formation and growth of intermetallic compound (IMC) at the interface of Sn-4.0%Ag-0.5%Cu reflow soldered on different types of substrate pad surface finishes (OSP and ENIG). This paper discusses the effect of IMC growth after soldering and thermal aging at 150degC. The attachment strength of solder balls with thermal aging is investigated by ball shear and cold bump pull (CBP) tests. The test results indicate that the CBP test method can reveal the brittle failure of solder joints with a higher sensitivity, especially under the fast pulling speed
Keywords :
ageing; brittle fracture; copper alloys; mechanical testing; reflow soldering; reliability; silver alloys; solders; tin alloys; 150 degC; IMC thickness; SnAgCu; attachment strength; ball shear tests; brittle failure; cold bump pull tests; intermetallic compound; lead-free solder joint reliability; reflow soldering; solder interconnection; substrate pad surface finishes; thermal aging; Aging; Electronic equipment testing; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Ovens; Performance evaluation; Soldering; Temperature;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
DOI :
10.1109/IMPACT.2006.312202
