• DocumentCode
    1584179
  • Title

    A New Nano-Probe Using Micro Assembly Transfer

  • Author

    Chen, Jen-Yi ; Lin, Chun-Te ; Liao, Wei-Chuan ; Hui Chi Su ; Tsai, Ching-Hsiang ; Chiang, Kuo-Ning

  • Author_Institution
    Microsystems Technol. Center, Ind. Technol. Res. Inst., Tainan
  • fYear
    2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to be easily assembly on a tuning fork sensor. By taking advantages of surface micromachined tip fabrication, the subsequent assembly-transfer procedures are able to minimize the mass load effect of a tuning fork based atomic force microscopy (AFM). Furthermore, the micro assembly transfer of nano-probes can also be achieved to manufacture devices in an easy way and to mount the probe precisely. This approach is compatible with CMOS process and able to integrate micromachined probes into an alternative host chip
  • Keywords
    CMOS integrated circuits; atomic force microscopy; force sensors; microassembling; micromachining; microsensors; nanotechnology; AFM; CMOS process; assembly-transfer procedures; atomic force microscopy; force sensing nano-probe; manufacture devices; micro assembly transfer; micromachined probes; surface micromachined tip fabrication; tuning fork sensor; Assembly; Atomic force microscopy; Atomic measurements; Costs; Fabrication; Force sensors; Manufacturing; Nanoscale devices; Probes; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
  • Conference_Location
    Taipei
  • Print_ISBN
    1-4244-0735-4
  • Electronic_ISBN
    1-4244-0735-4
  • Type

    conf

  • DOI
    10.1109/IMPACT.2006.312211
  • Filename
    4107468