DocumentCode
1584179
Title
A New Nano-Probe Using Micro Assembly Transfer
Author
Chen, Jen-Yi ; Lin, Chun-Te ; Liao, Wei-Chuan ; Hui Chi Su ; Tsai, Ching-Hsiang ; Chiang, Kuo-Ning
Author_Institution
Microsystems Technol. Center, Ind. Technol. Res. Inst., Tainan
fYear
2006
Firstpage
1
Lastpage
4
Abstract
This paper demonstrates a new force sensing nano-probe that allows a cost effective nano-tip to be easily assembly on a tuning fork sensor. By taking advantages of surface micromachined tip fabrication, the subsequent assembly-transfer procedures are able to minimize the mass load effect of a tuning fork based atomic force microscopy (AFM). Furthermore, the micro assembly transfer of nano-probes can also be achieved to manufacture devices in an easy way and to mount the probe precisely. This approach is compatible with CMOS process and able to integrate micromachined probes into an alternative host chip
Keywords
CMOS integrated circuits; atomic force microscopy; force sensors; microassembling; micromachining; microsensors; nanotechnology; AFM; CMOS process; assembly-transfer procedures; atomic force microscopy; force sensing nano-probe; manufacture devices; micro assembly transfer; micromachined probes; surface micromachined tip fabrication; tuning fork sensor; Assembly; Atomic force microscopy; Atomic measurements; Costs; Fabrication; Force sensors; Manufacturing; Nanoscale devices; Probes; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location
Taipei
Print_ISBN
1-4244-0735-4
Electronic_ISBN
1-4244-0735-4
Type
conf
DOI
10.1109/IMPACT.2006.312211
Filename
4107468
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