• DocumentCode
    1584446
  • Title

    Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules

  • Author

    El khadiry, A. ; Richardeau, Frederic ; Bourennane, A. ; Zhifeng, D. ; Breil, Marie

  • Author_Institution
    LAAS, Toulouse, France
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Starting from the common anode and common cathode multi-switch Si-chips, this paper focuses on the different association techniques of the two power chips on the usual substrates (DBC/IMS). The study uses 3D multiphysics COMSOL simulations to determine the best association that would allow the best electrical performance of power converters.
  • Keywords
    integrated circuit packaging; modules; power convertors; power integrated circuits; 3D multiphysics COMSOL simulations; DBC-IMS; Si; association techniques; common anode multiswitch silicon-chips; common cathode multiswitch silicon-chip structures; electrical performance; on-substrate packaging techniques; power chips; power converters; power modules; Anodes; Cathodes; Inductance; Substrates; Switches; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE), 2013 15th European Conference on
  • Conference_Location
    Lille
  • Type

    conf

  • DOI
    10.1109/EPE.2013.6634426
  • Filename
    6634426
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1584446