• DocumentCode
    1584820
  • Title

    Data Mining and Support Vector Regression Machine Learning in Semiconductor Manufacturing to Improve Virtual Metrology

  • Author

    Lenz, Benjamin ; Barak, Bernd

  • fYear
    2013
  • Firstpage
    3447
  • Lastpage
    3456
  • Abstract
    Advanced Process Control is an important research area in Semiconductor Manufacturing to improve process stability crucial for product quality. Especially in low-volume-high-mixture fabrication plants, knowledge discovery in databases is extremely challenging due to complex technology mixtures and reduced availability of data for comparable process steps. Thus, actual research focuses on Data Mining using Machine Learning methods to model unknown functional interrelations. High Density Plasma Chemical Vapor Deposition appears to be a process area in semiconductor manufacturing predestinated for application of Data Mining. Promising results have been achieved by implementing statistical models to predict the thickness of dielectric layers deposited onto a metallization layer of the manufactured wafer. This paper describes the approach to predict the layer thickness using a state-of-the-art Machine Learning regression algorithm: Support Vector Regression. The recent extension of Support Vector Machines overcomes pure classification and deals with multivariate nonlinear input data for regression.
  • Keywords
    Manufacturing; Metrology; Optimization; Prediction algorithms; Process control; Semiconductor device measurement; Support vector machines; Chemical Vapor Deposition; Data Mining; Feature Selection; Generic Data Mining System; Knowledge Discovery in Databases; Machine Learning; Semiconductor Manufacturing; Support Vector Regression; Virtual Metrology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Sciences (HICSS), 2013 46th Hawaii International Conference on
  • Conference_Location
    Wailea, HI, USA
  • ISSN
    1530-1605
  • Print_ISBN
    978-1-4673-5933-7
  • Electronic_ISBN
    1530-1605
  • Type

    conf

  • DOI
    10.1109/HICSS.2013.163
  • Filename
    6480260