Title :
An overview of where the fields of SoCs, HDI and MEMS are heading to and how to characterize them
Author_Institution :
CSEM
Keywords :
Micromechanical devices; Very large scale integration;
Conference_Titel :
Very Large Scale Integration, 2006 IFIP International Conference on
Conference_Location :
Nice, France
Print_ISBN :
3-901882-19-7
DOI :
10.1109/VLSISOC.2006.313280
