Title :
Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs
Author :
Frye, Robert C. ; Gabara, Thaddeus J. ; Tai, King L. ; Fischer, Wilhelm C. ; Knauer, Scott C.
Author_Institution :
AT&T Bell Lab., Murray Hill, NJ, USA
Abstract :
Compared to conventional packaging, multichip modules have significantly reduced capacitive loading in their interconnections. The authors present experimental results showing the performance of I/O buffers specially designed to operate in this environment, evaluated in several different silicon-on-silicon test modules
Keywords :
CMOS digital integrated circuits; application specific integrated circuits; buffer circuits; integrated circuit interconnections; integrated circuit packaging; multichip modules; MCM chip-to-chip interconnections; Si; custom I/O buffer designs; performance; reduced capacitive loading; Driver circuits; Energy consumption; Integrated circuit interconnections; Integrated circuit packaging; Multichip modules; Parasitic capacitance; Silicon; Voltage; Wire; Working environment noise;
Conference_Titel :
ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-1375-5
DOI :
10.1109/ASIC.1993.410760
