• DocumentCode
    1585803
  • Title

    High temperature growth of SiC and group III nitride structures in production reactors

  • Author

    Schmitz, D. ; Beccard, R. ; Strauch, G. ; Juergensen, H. ; Woelk, E. ; Bremser, M.

  • Author_Institution
    AIXTRON AG, Aachen, Germany
  • fYear
    1998
  • Firstpage
    5
  • Lastpage
    9
  • Abstract
    We describe the use of a family of high temperature reactors to grow SiC and nitrides. The load capacity ranges from single wafer machines to multiple wafer mass production reactors. All these reactors have a two flow injection system allowing a separated inlet of the various reactants. To achieve maximum uniformity of the growth, the gas foil rotation principle is applied. The multiwafer reactors are planetary reactors with a double rotation of substrates. Extensive modeling has been used in order to find the optimum reactor geometries. Thus an optimization of uniformity and efficiency and a minimization of undesired parasitic reactions has been obtained
  • Keywords
    III-V semiconductors; MOCVD; gallium compounds; semiconductor growth; semiconductor process modelling; silicon compounds; vapour phase epitaxial growth; wide band gap semiconductors; GaN; InGaN; SiC; double substrate rotation; gas foil rotation principle; group III nitrides; growth uniformity; high temperature MOVPE growth; modeling; multiple wafer mass production reactors; optimum reactor geometries; parasitic reaction minimization; planetary reactors; production reactors; single wafer machines; two flow injection system; Gallium nitride; Hardware; Heat transfer; Inductors; Mass production; Semiconductor device modeling; Silicon carbide; Solid modeling; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    0-7803-4540-1
  • Type

    conf

  • DOI
    10.1109/HITEC.1998.676751
  • Filename
    676751