DocumentCode :
1585803
Title :
High temperature growth of SiC and group III nitride structures in production reactors
Author :
Schmitz, D. ; Beccard, R. ; Strauch, G. ; Juergensen, H. ; Woelk, E. ; Bremser, M.
Author_Institution :
AIXTRON AG, Aachen, Germany
fYear :
1998
Firstpage :
5
Lastpage :
9
Abstract :
We describe the use of a family of high temperature reactors to grow SiC and nitrides. The load capacity ranges from single wafer machines to multiple wafer mass production reactors. All these reactors have a two flow injection system allowing a separated inlet of the various reactants. To achieve maximum uniformity of the growth, the gas foil rotation principle is applied. The multiwafer reactors are planetary reactors with a double rotation of substrates. Extensive modeling has been used in order to find the optimum reactor geometries. Thus an optimization of uniformity and efficiency and a minimization of undesired parasitic reactions has been obtained
Keywords :
III-V semiconductors; MOCVD; gallium compounds; semiconductor growth; semiconductor process modelling; silicon compounds; vapour phase epitaxial growth; wide band gap semiconductors; GaN; InGaN; SiC; double substrate rotation; gas foil rotation principle; group III nitrides; growth uniformity; high temperature MOVPE growth; modeling; multiple wafer mass production reactors; optimum reactor geometries; parasitic reaction minimization; planetary reactors; production reactors; single wafer machines; two flow injection system; Gallium nitride; Hardware; Heat transfer; Inductors; Mass production; Semiconductor device modeling; Silicon carbide; Solid modeling; Substrates; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4540-1
Type :
conf
DOI :
10.1109/HITEC.1998.676751
Filename :
676751
Link To Document :
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