An alternative packaging solution for moderate HOT environments in high volume applications

Summary form only given. We have developed an electronic packaging technology in which the circuits are directly deposited onto insulated metal substrates. This packaging has several fold better thermal conductivity than conventional ceramic or polyimide glued-to-heat-sink high operating temperature (HOT) packaging, is more mechanically robust than ceramic, is lightweight and compact and can be deposited on 3-dimensional surfaces to minimize space requirements. Multilayer circuits with dimensions as small as 50 μm lines and spaces 75 μm vias are possible as well as large dimension circuits for power applications. This approach is also more cost effective than conventional HOT packaging