DocumentCode
1586277
Title
BIST Scheme for Low Heat Dissipation and Reduced Test Application Time
Author
Shah, Malav ; Nagchoudhuri, Dipankar
Author_Institution
Dhirubhai Ambani Inst. of Inf. & Commun. Technol., Gandhinagar
fYear
2006
Firstpage
239
Lastpage
244
Abstract
This paper presents a simple yet efficient low hardware overhead testing scheme for scan-based built-in self-test (BIST) architecture that reduces switching activity (SA) in CUTs and test application time without compromising in the fault coverage. First demonstrated is the low transition LFSR (LT-LFSR) based test-per-scan scheme targeted for low heat dissipation during test by reducing the number of transitions at the cost of reduced fault coverage. Further explained is a proposed combined approach using both test-per-scan and test-per-clock application schemes, adding above LT-LFSR as the TPG and MISR for signature analysis. Experiments conducted on different ISCAS89 benchmark circuits shows that proposed scheme gives quite better fault coverage, that too, with a large reduction in test lengths and transitions (hence heat dissipation during testing)
Keywords
built-in self test; cooling; logic testing; switching circuits; BIST scheme; CUT; MISR; TPG; built in self test; hardware overhead testing; low heat dissipation; low transition LFSR; signature analysis; switching activity; test application time; test-per-scan scheme; Automatic testing; Benchmark testing; Built-in self-test; Circuit faults; Circuit testing; Costs; Pattern analysis; Registers; System testing; Test pattern generators;
fLanguage
English
Publisher
ieee
Conference_Titel
Very Large Scale Integration, 2006 IFIP International Conference on
Conference_Location
Nice
Print_ISBN
3-901882-19-7
Type
conf
DOI
10.1109/VLSISOC.2006.313240
Filename
4107636
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