• DocumentCode
    1586277
  • Title

    BIST Scheme for Low Heat Dissipation and Reduced Test Application Time

  • Author

    Shah, Malav ; Nagchoudhuri, Dipankar

  • Author_Institution
    Dhirubhai Ambani Inst. of Inf. & Commun. Technol., Gandhinagar
  • fYear
    2006
  • Firstpage
    239
  • Lastpage
    244
  • Abstract
    This paper presents a simple yet efficient low hardware overhead testing scheme for scan-based built-in self-test (BIST) architecture that reduces switching activity (SA) in CUTs and test application time without compromising in the fault coverage. First demonstrated is the low transition LFSR (LT-LFSR) based test-per-scan scheme targeted for low heat dissipation during test by reducing the number of transitions at the cost of reduced fault coverage. Further explained is a proposed combined approach using both test-per-scan and test-per-clock application schemes, adding above LT-LFSR as the TPG and MISR for signature analysis. Experiments conducted on different ISCAS89 benchmark circuits shows that proposed scheme gives quite better fault coverage, that too, with a large reduction in test lengths and transitions (hence heat dissipation during testing)
  • Keywords
    built-in self test; cooling; logic testing; switching circuits; BIST scheme; CUT; MISR; TPG; built in self test; hardware overhead testing; low heat dissipation; low transition LFSR; signature analysis; switching activity; test application time; test-per-scan scheme; Automatic testing; Benchmark testing; Built-in self-test; Circuit faults; Circuit testing; Costs; Pattern analysis; Registers; System testing; Test pattern generators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Very Large Scale Integration, 2006 IFIP International Conference on
  • Conference_Location
    Nice
  • Print_ISBN
    3-901882-19-7
  • Type

    conf

  • DOI
    10.1109/VLSISOC.2006.313240
  • Filename
    4107636