Title :
Reliability of discrete power semiconductor packages and systems — D2Pak and CanPAK in comparison
Author :
Hofmann, Klaus ; Herold, C. ; Beier, Menia ; Lutz, Josef ; Friebe, Jens
Author_Institution :
Dept. of Power Electron. & EMC, Chemnitz Univ. of Technol., Chemnitz, Germany
Abstract :
The reliability of discrete power semiconductor packages is getting more and more important in regard to the increasing number of power applications in the low power range. Therefore it is necessary to get more information and details on reliability of discrete packages and systems by performing reliability tests as well as simulations. In this paper the chosen approach and first results of simulations and tests are described on D2Pak and CanPAK systems as often used discrete power semiconductor packages.
Keywords :
packaging; power semiconductor devices; semiconductor device reliability; CanPAK system; D2Pak system; discrete power semiconductor package reliability; discrete power semiconductor system reliability; low power range; Analytical models; Heat sinks; Load modeling; Materials; Reliability; Temperature distribution; Thermal loading; Discrete power device; Packaging; Power cycling; Reliability;
Conference_Titel :
Power Electronics and Applications (EPE), 2013 15th European Conference on
Conference_Location :
Lille
DOI :
10.1109/EPE.2013.6634611
