Title :
Reliability of high temperature electronic components
Author :
Anderson, Wallace T.
Author_Institution :
Naval Res. Lab., Washington, DC, USA
Abstract :
A review is given of high temperature reliability efforts on solid-state electronic components. To date, most of this work has been concerned with high temperature stressing, usually for short periods of time (less than 100 hours) to demonstrate stability. To field high temperature devices in the future, comprehensive high temperature reliability studies will be required
Keywords :
high-temperature electronics; reviews; semiconductor device reliability; high temperature electronic components; high temperature stressing; reliability; stability; Electronic components; FETs; Gallium arsenide; Integrated circuit reliability; Laboratories; Microwave devices; Power system reliability; Semiconductor device reliability; Semiconductor devices; Temperature;
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4540-1
DOI :
10.1109/HITEC.1998.676777
