• DocumentCode
    1586496
  • Title

    Evaluation of the submodel technique for FEM simulations of power electronic housings under power cycling conditions

  • Author

    Tinschert, Lukas ; Hofmann, Klaus ; Poller, Tilo ; Lutz, Josef

  • Author_Institution
    Dept. of Power Electron. & EMC, Chemnitz Univ. of Technol., Chemnitz, Germany
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    The submodel technique was mainly developed in mechanical engineering for complex parts and assemblies. In the simulations of microelectronics housing the technique was successful implemented for thermal cycling conditions. In thispaper the evaluation of the submodel technique for power electronic packages under power cycling conditions will be discussed.
  • Keywords
    electronics packaging; finite element analysis; power electronics; FEM simulations; complex assemblies; complex parts; mechanical engineering; microelectronics housing; power cycling conditions; power electronic housings; power electronic packages; submodel technique; thermal cycling conditions; Abstracts; Analytical models; Temperature distribution; Thermal analysis; Discrete power device; Modelling; Packaging; Power cycling; Reliability; Simulation; Thermal stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE), 2013 15th European Conference on
  • Conference_Location
    Lille
  • Type

    conf

  • DOI
    10.1109/EPE.2013.6634614
  • Filename
    6634614
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1586496