DocumentCode
1586640
Title
Chemical metallization of ceramic substrates-an alternative to thick and thin film technology
Author
Feil, Michael
Author_Institution
Fraunhofer-Inst. for Solid State Technol., Munich, West Germany
fYear
1988
Firstpage
106
Lastpage
111
Abstract
The material properties of chemically deposited copper and patterning techniques are described. This is followed by a depiction of the RF capability and important mechanical properties such as adhesive strength, solderability, and bondability. Starting points for the integration of resistors and multilayer metallizations are suggested. An example for practical application is given.<>
Keywords
ceramics; integrated circuit technology; metallisation; RF capability; adhesive strength; bondability; ceramic substrates; metallization; multilayer metallizations; patterning techniques; resistors; solderability; Adhesive strength; Bonding; Ceramics; Chemicals; Copper; Material properties; Mechanical factors; Metallization; Radio frequency; Resistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location
Lake Buena Vista, FL, USA
Type
conf
DOI
10.1109/EMTS.1988.16159
Filename
16159
Link To Document