• DocumentCode
    1587060
  • Title

    Advanced SPICE-modelling of 6H-SiC-JFETs including substrate effects

  • Author

    Zappe, S. ; Obermeier, E. ; Sheppard, S.T. ; Schmid, U. ; Lauer, V. ; Wondrak, W.

  • Author_Institution
    Microsensor & Actuator Technol. Center, Tech. Univ. Berlin, Germany
  • fYear
    1998
  • Firstpage
    261
  • Lastpage
    264
  • Abstract
    This work presents an expression for the drain source current I D, suitable for SPICE simulations of a 6H-SiC-JFET with an implanted gate area. Due to the lack of semi-insulating 6H substrates, such a JFET is influenced by the gate- and the substrate-channel-pn-junction and cannot be described with common JFET SPICE models. Accurate modeling is achieved by introducing a saturation voltage parameter α(VGS) similar to that used for the description of GaAs-MESFETs (VGS=gate source voltage). The applicability of the model is demonstrated using measurements on 6H-SiC-JFETs fabricated by Daimler Bent AG, Frankfurt. Even characteristics measured at 400°C are successfully modelled
  • Keywords
    SPICE; high-temperature electronics; junction gate field effect transistors; semiconductor device models; semiconductor device reliability; semiconductor materials; silicon compounds; 400 degC; JFETs; SPICE; SiC; drain source current; gate-channel-pn-junction; implanted gate area; saturation voltage parameter; semiconductor device modelling; substrate effects; substrate-channel-pn-junction; Actuators; Integrated circuit measurements; Integrated circuit modeling; MOSFETs; Microsensors; SPICE; Silicon carbide; Thermionic emission; USA Councils; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    0-7803-4540-1
  • Type

    conf

  • DOI
    10.1109/HITEC.1998.676800
  • Filename
    676800