Title :
Real-time degradation monitoring and lifetime estimation of 3D integrated bond-wire-less double-sided cooled power switch technologies
Author :
Tianxiang Dai ; Jian Feng Li ; Corfield, Martin ; Castellazzi, Alberto ; Wheeler, Pat
Author_Institution :
Power Electron., Machines & Control (PEMC) Group, Univ. of Nottingham, Nottingham, UK
Abstract :
This paper introduces a methodology for real-time degradation monitoring and reliability assessment of novel sandwich-type integrated power switches during passive thermal cycling. The proposed approach enables to realistically monitor degradation from time zero, allowing the flexible definition of the most suitable failure criteria and test time.
Keywords :
failure analysis; power semiconductor switches; reliability; 3D integrated bond-wire-less double-sided cooled power switch technologies; failure criteria; lifetime estimation; passive thermal cycling; real-time degradation monitoring; reliability assessment; sandwich-type integrated power switches; test time; Assembly; Cooling; Degradation; Insulated gate bipolar transistors; Reliability; Switches; Temperature measurement; Bondwire-less interconnection; Double-Sided Cooling; Packaging; Reliability;
Conference_Titel :
Power Electronics and Applications (EPE), 2013 15th European Conference on
Conference_Location :
Lille
DOI :
10.1109/EPE.2013.6634636
