DocumentCode
158728
Title
Conditioning development in vacuum based on breakdown probability distribution
Author
Kojima, H. ; Otake, Yoshito ; Sakaki, Masayuki ; Saito, Hiroshi ; Hasegawa, Kiyotomo ; Hayakawa, Naoki
Author_Institution
Nagoya Univ., Nagoya, Japan
fYear
2014
fDate
Sept. 28 2014-Oct. 3 2014
Firstpage
13
Lastpage
16
Abstract
Spark conditioning is important for the enhancement of insulation strength in vacuum. In order to enhance the insulation performance of vacuum circuit breakers, we have to clarify the conditioning effect and improve a conditioning procedure. In this paper, we discuss the conditioning process of Cu and stainless steel rod electrodes based on breakdown (BD) probability distribution. We applied a negative impulse voltage to a rod-plane electrode configuration. We adopted two procedures for the voltage application, i.e. up-down and 3 times methods. For the Cu rod with the up-down method, BD voltage increased by the conditioning effect, however, the minimum BD voltage did not increase or even decreased due to the damage by BD. A moderate conditioning procedure, e.g. 3 times method, could increase the minimum BD voltage as well as the stabilization of insulation strength. The Weibull analysis of the development of a BD probability distribution has enabled us to evaluate the damaging effect. Based on these results, we can discuss a suitable conditioning procedure.
Keywords
Weibull distribution; copper; sparks; stainless steel; vacuum breakdown; Cu; Cu rod electrode; Weibull analysis; breakdown probability distribution; conditioning effect; damaging effect; insulation strength stabilization; minimum breakdown voltage; moderate conditioning procedure; negative impulse voltage; rod-plane electrode configuration; spark conditioning; stainless steel rod electrode; up-down method; vacuum circuit breakers; voltage application; Discharges (electric); Electric fields; Electrodes; Insulation; Probability distribution; Steel;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location
Mumbai
Print_ISBN
978-1-4799-6750-6
Type
conf
DOI
10.1109/DEIV.2014.6961607
Filename
6961607
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