DocumentCode :
158749
Title :
Investigation of grooved surface suppressing multipactor across HPM dielectric window
Author :
Bai-Peng Song ; Hai-Bao Mu ; Guan-Jun Zhang ; Zhuang-Zhuang Fan ; Chun-Liang Liu ; Mei-You Shi ; Yong Liao
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2014
fDate :
Sept. 28 2014-Oct. 3 2014
Firstpage :
97
Lastpage :
100
Abstract :
Microwave breakdown phenomenon across dielectric window at the vacuum/dielectric interface limits the transmission of HPM and becomes a bottleneck of HPM technology development. Its avoidance or suppression is a major concern among researchers on HPM sources. Currently, the most effective approach is geometrical modification with the goal of altering the trajectories of electrons. In this paper, periodic rectangular grooves perpendicular to microwave electric field, are applied to improve the threshold of breakdown. To clarify the mechanism, the SEEA simulation model based on dynamic analysis and particle-in-cell (PIC) is built in this paper. The grooves change the electrons trajectories and eventually resonant multipactor condition may no longer be satisfied. The suppression effect is influenced by the grooves and each given width relates to an effective power range for suppression. Dielectric breakdown experiments under HPM of S-band at 2.86 GHz are conducted with the grooved dielectric window. The results of the experiment are consistent with theoretical analysis and simulation.
Keywords :
electric breakdown; electric fields; microwave switches; HPM dielectric window; HPM technology development; S-band; SEEA simulation model; dielectric breakdown; dynamic analysis; electron trajectories; frequency 2.86 GHz; grooved surface suppressing multipactor; microwave breakdown phenomenon; microwave electric field; particle-in-cell; periodic rectangular grooves; resonant multipactor condition; suppression effect; vacuum-dielectric interface; Dielectrics; Electric fields; Flashover; Microwave theory and techniques; Surface charging; Surface discharges;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4799-6750-6
Type :
conf
DOI :
10.1109/DEIV.2014.6961628
Filename :
6961628
Link To Document :
بازگشت