• DocumentCode
    158775
  • Title

    Simulation of the molten metal behavior during the crater formation on the cathode surface in a vacuum arc

  • Author

    Mesyats, G.A. ; Uimanov, I.V.

  • Author_Institution
    P.N. Lebedev Phys. Inst., Moscow, Russia
  • fYear
    2014
  • fDate
    Sept. 28 2014-Oct. 3 2014
  • Firstpage
    205
  • Lastpage
    208
  • Abstract
    2D axially symmetric hydrodynamic model has been developed to describe the formation of a crater and liquid-metal jets on a vacuum arc cathode using Navier-Stokes equations for an incompressible viscous fluid with a free surface and a heat conduction equation taking into account convective heat transfer. The formation of an elemental crater on a copper cathode during the operation of a cathode spot cell has been numerically simulated by varying the heat flux and the pressure produced by the cathode plasma. Based of the simulation results, we can distinguish three different modes of the crater formation process: “no splashing”, “inertial splashing”, and “active splashing”. It has been shown that a crater with metal jets forced away can be formed within 30 ns of plasma action if the heat flux density is above 1012 W/m2 and the pressure is above 108 Pa.
  • Keywords
    Navier-Stokes equations; cathodes; copper; heat conduction; plasma jets; plasma pressure; plasma simulation; vacuum arcs; 2D axially symmetric hydrodynamic model; Cu; Navier-Stokes equations; active splashing; cathode surface; convective heat transfer; copper cathode; crater formation; free surface; heat conduction equation; incompressible viscous fluid; inertial splashing; liquid-metal jets; molten metal behavior simulation; plasma pressure; time 30 ns; vacuum arc; Cathodes; Heating; Hydrodynamics; Mathematical model; Metals; Plasma temperature; Vacuum arcs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4799-6750-6
  • Type

    conf

  • DOI
    10.1109/DEIV.2014.6961655
  • Filename
    6961655