Title :
Compact radio system module for triple-band GSM cellular phones
Author :
Okabe, Hiroshi ; Ido, Tatemi ; Endo, Tsuneo
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Abstract :
A compact radio system module, 10×10.3×1.2 mm3, for triple-band GSM cellular phones is presented. The module was miniaturized by employing a simple front-end architecture, highly integrated transceiver IC, one chip HPA-MMIC, and thin four-layer laminate substrate. Design considerations for a very compact radio system module, i.e., techniques for avoiding thermal and electrical interaction, are discussed. The excellent performance of the developed module, which is reflected in its high thermal and electrical isolation, is demonstrated.
Keywords :
MMIC; UHF power amplifiers; cellular radio; hybrid integrated circuits; mobile handsets; multichip modules; thermal management (packaging); transceivers; 1.2 mm; 10 mm; 10.3 mm; GSM cellular phones; compact radio system module; electrical isolation; electromagnetic coupling; hybrid integrated circuit packaging; integrated transceiver IC; multichip modules; one chip HPA-MMIC; power amplifiers; thermal isolation; thin multilayer laminate substrate; triple-band cellular phones; Cellular phones; GSM; High power amplifiers; Hybrid integrated circuits; Laminates; MMICs; Packaging; Radio frequency; Switches; Transceivers;
Conference_Titel :
Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE
Print_ISBN :
0-7803-8983-2
DOI :
10.1109/RFIC.2005.1489782
