DocumentCode :
1587835
Title :
Preparation of polycrystalline silicon thin films by pulsed ion-beam evaporation
Author :
Yang, S.-C. ; Suzuki, T. ; Jiang, W. ; Yatsui, K.
Author_Institution :
Extreme Energy-Density Res. Inst., Nagaoka Univ. of Technol., Niigata, Japan
Volume :
2
fYear :
2001
Firstpage :
1842
Abstract :
By intense pulsed ion beam evaporation, we have succeeded in the preparation of polycrystalline silicon thin films on silicon substrate. High crystallinity and deposition rate have been achieved without heating the substrate. The crystallinity of poly-Si film has been improved with increasing the density of the ablation plasma, where the grain size of the film has been found to be much smaller. To enhance the crystallinity and density of poly-Si thin film, bias voltage was applied to the substrate, where the quality of poly-Si film has been improved by the ion bombardment.
Keywords :
elemental semiconductors; evaporation; ion beam effects; plasma deposition; semiconductor thin films; silicon; Si; Si substrate; ablation plasma density; bias voltage; crystallinity; deposition rate; grain size; intense pulsed ion beam evaporation; ion bombardment; plasma deposition; poly-Si film density; poly-Si film quality; polycrystalline silicon thin films preparation; Crystallization; Grain size; Heating; Ion beams; Plasma density; Semiconductor thin films; Silicon; Substrates; Transistors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Pulsed Power Plasma Science, 2001. PPPS-2001. Digest of Technical Papers
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
0-7803-7120-8
Type :
conf
DOI :
10.1109/PPPS.2001.1001933
Filename :
1001933
Link To Document :
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