DocumentCode
158790
Title
3D numerical simulation of vacuum arc with anode vapor in actual magnetic fields
Author
Huang, X.L. ; Wang, L. ; Jia, S. ; Deng, Jiansong ; Qian, Z.H. ; Shi, Z. ; Schellenkens, H. ; Godechot, X.
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear
2014
fDate
Sept. 28 2014-Oct. 3 2014
Firstpage
265
Lastpage
268
Abstract
Characteristics of vacuum arc seriously influence the interruption ability of vacuum switches. In many cases (especially in commercial electrode systems), vacuum arcs are not completely axial symmetrical configuration. So, three-dimensional simulation of vacuum arc is needed. On the other hand, when the interruption current is very high, the anode will be in active state and becomes another source of inter-electrode plasma. In this paper, a time dependent actual magnetic field generated by commercial cup-shaped axial magnetic field (AMF) electrode is simulated. With this magnetic field and the simulation results of anode temperature, the dynamic characteristics of vacuum arc considering anode vapor pressure (also considering simplified cathode spots diffusion and open process of electrode) are obtained. In the simulation results, the magnetic field distribution of commercial cup-shaped electrode is six leaves shape, and so do other parameters. There are some ions pressed by high anode vapor pressure from anode to arc column.
Keywords
numerical analysis; plasma magnetohydrodynamics; plasma simulation; plasma temperature; plasma transport processes; vacuum arcs; vacuum switches; 3D numerical simulation; anode temperature; anode vapor; arc column; cup-shaped axial magnetic field electrode; diffusion; dynamic characteristics; inter-electrode plasma; magnetic field distribution; three-dimensional simulation; time dependent actual magnetic field; vacuum arc; Anodes; Heating; Magnetic fields; Mathematical model; Solid modeling; Vacuum arcs;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location
Mumbai
Print_ISBN
978-1-4799-6750-6
Type
conf
DOI
10.1109/DEIV.2014.6961670
Filename
6961670
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